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        DHG 30 IM 600 PC advanced IRMS A per pin 1) 35 RthCH K/W 0.25 Tstg °C 150 storage temperature -55 Weight g 2 Symbol Definition Ratings typ. max. min. Conditions RMS current thermal resistance case to heatsink Unit 1) I is typically limited by: 1. pin-to-chip reRMS sistance; or by 2. current capability of the chip. In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting the backside. FC N 60 mounting force with clip 20 Ordering Delivering Mode Base Qty Code Key Standard Part Name DHG 30 IM 600 PC 503501 Tape & Reel 800 Product Marking Date Code Part No. Logo Order Code XXXXXXXXX IXYSyww abcd D = H = G = 30 = IM = 600 = PC = Part number Diode Sonic Fast Recovery Diode extreme fast Single Diode TO-263AB (D2Pak) (2) DHG30I600PA DHG30I600HA TO-220 TO-247 Similar Part Package Marking on Product DHG30IM600PC 600 600 Voltage Class Current Rating [A] Reverse Voltage [V] IXYS reserves the right to change limits, conditions and dimensions. ? 2008 IXYS all rights reserved 20081031 Data according to IEC 60747and per diode unless otherwise specified |